DIP-View has presented at SEMICON Europe its latest technologies for 3D wafer inspection with disruptive capabilities. A full static measurement of Bow, Warp, TTv, LTv with dual wafer side capabilities up to 300mm. From mm to nm in one single shot !
Read MoreDIP-View launched Vision 300
Ultra Fast Optical Metrology for 12" Wafers
ABOUT US
DIP-View is a pioneer in High Resolution Deflectometry for critical surfaces metrology applications (Warpage, Roughness, Nano-Topography) .
DIP-View is adressing multiple industrial segments (Semi-conductors, Automotive, Optics, ...).
Get into disruptive metrology innovation...
DIP-View is adressing multiple industrial segments (Semi-conductors, Automotive, Optics, ...).
Get into disruptive metrology innovation...
Dip-View Founding Team
Fernando MOREIRA
President
Serial entrepreneur in high tech industries - Leading International Business Development.
Alexandre ARNOULT
CTO
Phd in Physics and microelectronics, Senior Research fellow at LAAS, with a successful track record in Research to Industry technology transfers.
Bastien GRIMALDI
R&D Leader
Innovative research optical engineer, expert in optical design and instrumentation software.
Technologies and Products
High Resolution Deflectometry
Surface warpage metrology from Global (mm) to Local (nm) in one shot measurement - Highest Lateral Resolution : 20Mpixels to cover 20mm2
D-Surface View
D-Surface View is intended to analyze flat surfaces up to 300-mm diameter. The equipment can be used for example for wafer surface quality control, it qualifies surface roughness, shape, flatness, warpage and nano-topography, other applications can be automotive mirrors or optical components.
Learn MoreD-Surface View
High Accuracy and Fast 2D and 3D measurements
2D and 3D Texture, Roughness and Waviness forms, 2D and 3D bow and shape, 2D Thin film stress, defects and 2D/3Ddefect surface mapping.
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Technical Specifications
2D and 3D step heights, 2D profiles and 3D views of the measurements, 2D and 3D roughness and waviness analysis, 2D and 3D filtering and leveling techniques, Thin film stress and sample bow calculation
Learn MoreProduct Features
Warpage measurement
D-Surface View provides a FULL SURFACE warpage measurement in one single acquisition. Users can extract critical parameters such as Bow, Warp, TTv, LTv in a few seconds.
Nano-Topography measurement
D-Surface View can explore Nano-topograpgy characteristics and detect polishing inhomogeneities or other nanometer height defects. With powerful fourrier transform filters users can visualise short frequency and high frequency defect patterns.
Data Analytics on a large range of measurement
In one single high resolution image and pure static acquisition D-Surface View can extract from mm level down to nm level in a few seconds, users can explore the full field image at the required resolution and process through Data Analytics algorithms and Open data formats.
Global System Partners
EUROPE - ASIA - USA
Contact
- Toulouse, Occitanie, France
News
BPI France has recognised the highly innovative technology brought by DIP-View for the 3D surface inspection market. Dip-View is now listed as a French DEEPTECH company and will be supported by BPI French innovation organisation to grow its business.
Read MoreDIP-View has now joined as a member of the SEMI Organisation to contribute actively to the development of metrology technologies in the Semiconductor market. DIP-View has also joined AENEAS (Association for European NanoElectronics ActivitieS), the industrial Association to support access to funding to all types RD&I participants in the field of micro and nanoelectronics enabled components and systems.
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