SEMICON Korea 2026
Great success at SEMICON Korea, where DIP-View introduced its Advanced Packaging Metrology leveraging High Resolution Deflectometry. Thanks to everyone who visited our booth, and to our local partner Woowon Technology.
Integrated Wafer Metrology Platform
Measurement that goes beyond limits
VISION 300 — one platform, five integrated measurement domains, one seamless workflow. Wafer geometry, nano-topography, film thickness, bonding metrology and surface inspection, intrinsically co-registered.
Visit us at SEMICON® TaiwanSep 2–4, 2026 · TaiNEX 1, Taipei
Booth N0362
120+WPHHigh-Volume Manufacturing
<1 nmVertical ResolutionNanometer Precision
50 µmLateral ResolutionFull-Wafer Mapping
>2 mmWarp RangeHighly Warped Wafers
About us
Leading metrology innovation for advanced packaging
DIP-View is a pioneer in High Resolution Deflectometry, allowing us to reach nanometer accuracy across the full 300 mm wafer surface. This powerful technology is at the heart of VISION 300, our integrated wafer metrology platform.
One platform, five measurement domains, one workflow — built exclusively for semiconductor manufacturers moving to D2W and W2W advanced packaging.
Integrated. Accurate. Repeatable.
High Throughput. Low Cost of Ownership.
Proven Technology. Trusted Partner.
DIP-View in motion
The precision behind the platform
A closer look at the VISION 300 hardware — engineered and assembled for nanometer-scale wafer metrology.
Dip-View Founding Team
The people behind DIP-View
Fernando Moreira
PresidentSerial entrepreneur in high tech industries — Leading International Business Development.
Alexandre Arnoult
CTOPhD in Physics and microelectronics, Senior Research fellow at LAAS, with a successful track record in Research to Industry technology transfers.
Bastien Grimaldi
R&D LeaderInnovative research optical engineer, expert in optical design and instrumentation software.
Integrated Wafer Metrology Platform
VISION 300
A unique integrated platform combining wafer geometry, nano-topography, film thickness, bonding metrology and surface inspection within a seamless measurement workflow.
All measurements are acquired on the same platform, intrinsically co-registered and analyzed within a unified software environment. By eliminating data correlation across multiple tools, VISION 300 accelerates process development, improves process control and enables faster, more confident manufacturing decisions.
Engineered for Next-Generation Semiconductor Manufacturing
Five Integrated Measurement Domains
One platform, every critical parameter
Wafer Geometry
- Bow / Warp / TTV
- SFQR
- Edge Roll-Off
- Global Shape
Nano-Topography
- Local Flatness
- CMP Monitoring
- Surface Texture
- Roughness
Film Thickness
- Thin Transparent Films
- Thickness Mapping
- Uniformity
- Stress Induced
Bonding Metrology
- Pre-bonding Shape
- Void Risk Assessment
- Chip Tilt / Warpage
- Edge Delaminations
Surface Inspection
- Surface Macro-defect
- Particles
- Scratches
- Pattern Breaks
Key Applications
Process Challenges We Solve
Helping manufacturers improve yield through better process understanding.
VISION 300 enables semiconductor manufacturers to detect, understand and correlate the process signatures that impact yield, reliability and manufacturing efficiency across advanced semiconductor applications.
Hybrid Bonding
Improve bonding readiness before wafers ever touch.
Higher bonding yield
Advanced Packaging
Control deformation across increasingly complex packages.
Better package yield
Wafer Manufacturing
Detect process variations before they impact downstream manufacturing.
Improved process stability
Silicon Photonics
Improve process uniformity for next-generation photonic devices.
Higher device performance
Image Sensors & MEMS
Characterize functional surfaces across large-area devices.
Better device consistency
3D Integration
Monitor deformation through successive integration steps.
Enhanced reliability
Global System Partners
Our worldwide network
USA & Canada
Europe
Asia
Contact
Let's talk metrology
LocationBâtiment Zephyr, 3 av Bernard Maris, 31400 Toulouse, France
Phone+33 647 347 719
Emailsales@dip-view.com
News
Latest updates
SEMICON Southeast Asia 2025
Proud to present our VISION 300 product at SEMICON SEA, featuring full automation with QES wafer robotics — merging Advanced Wafer Metrology and Defect Macro-Inspection into a single solution.
SEMICON Taiwan 2025
From Toulouse to Taiwan! DIP-View is taking its Asian expansion to the next level after a successful debut at SEMICON 2024 — exciting discussions on advanced packaging, warpage and nano-topography metrology.
SEMICON Taiwan 2024 — French Pavilion
DIP-View hosted Thomas Courbe from the French Economy Ministry (DGE) at SEMICON Taiwan's French Pavilion, with collaborations underway with ITRI and CEA.
Semicon Europe — 2023
DIP-View presented its latest technologies for 3D wafer inspection: a full static measurement of Bow, Warp, TTv, LTv with dual wafer side capabilities up to 300 mm. From mm to nm in one single shot!
Dip-View: a DEEPTECH Company
BPI France has recognised DIP-View's innovative technology for the 3D surface inspection market. DIP-View is now listed as a French DEEPTECH company.
Dip-View joins SEMI and AENEAS Associations
DIP-View has joined SEMI to contribute actively to the development of metrology technologies in the semiconductor market, and AENEAS, the industrial association supporting funding access for micro and nanoelectronics R&D&I participants.