Semicon Europe show - 2023

DIP-View has presented at SEMICON Europe its latest technologies for 3D wafer inspection with disruptive capabilities. A full static measurement of Bow, Warp, TTv, LTv with dual wafer side capabilities up to 300mm. From mm to nm in one single shot !

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Dip-View : a DEEPTECH Company

BPI France has recognised the highly innovative technology brought by DIP-View for the 3D surface inspection market. Dip-View is now listed as a French DEEPTECH company and will be supported by BPI French innovation organisation to grow its business.

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