DIP-View has presented at SEMICON Europe its latest technologies for 3D wafer inspection with disruptive capabilities. A full static measurement of Bow, Warp, TTv, LTv with dual wafer side capabilities up to 300mm. From mm to nm in one single shot !
Read MoreBPI France has recognised the highly innovative technology brought by DIP-View for the 3D surface inspection market. Dip-View is now listed as a French DEEPTECH company and will be supported by BPI French innovation organisation to grow its business.
Read MoreDIP-View has now joined as a member of the SEMI Organisation to contribute actively to the development of metrology technologies in the Semiconductor market. DIP-View has also joined AENEAS (Association for European NanoElectronics ActivitieS), the industrial Association to support access to funding to all types RD&I participants in the field of micro and nanoelectronics enabled components and systems.
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